Abstract/Details

Investigation of tractable models of coupling between MMICs in multi-chip assemblies


2001 2001

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Abstract (summary)

This work investigates tractable models of coupling between monolithic microwave integrated circuits (MMICs) in multi-chip assemblies (MCAs). In this dissertation, CAD algorithms are developed for computing the coupling between MMICs in a various types of MCAs such as multi-layer MCA, MCA with MMICs covered by dielectric covers, MCA with MMICs separated by baffles, and MCA with posts separating or around MMICs. These CAD algorithms are computationally simple, appropriate for use with layout-based circuit CAD software, and use no numerical electromagnetics. They have been tested by comparison to full wave electromagnetic simulations and measurements on frequency scaled down test structures. In simple test cases, these algorithms showed over two orders of magnitude increase in speed. For larger problems, the increase in speed will be more pronounced.

Indexing (details)


Subject
Electrical engineering
Classification
0544: Electrical engineering
Identifier / keyword
Applied sciences; MMICs; Microwave packaging; Multichip; Tractable coupling
Title
Investigation of tractable models of coupling between MMICs in multi-chip assemblies
Author
Wang, Zhaoyang
Number of pages
160
Publication year
2001
Degree date
2001
School code
0118
Source
DAI-B 62/04, Dissertation Abstracts International
Place of publication
Ann Arbor
Country of publication
United States
ISBN
9780493225517, 049322551X
Advisor
Jackson, Robert W.
University/institution
University of Massachusetts Amherst
University location
United States -- Massachusetts
Degree
Ph.D.
Source type
Dissertations & Theses
Language
English
Document type
Dissertation/Thesis
Dissertation/thesis number
3012192
ProQuest document ID
304702341
Copyright
Database copyright ProQuest LLC; ProQuest does not claim copyright in the individual underlying works.
Document URL
http://search.proquest.com/docview/304702341
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