Design of a millimeter wave active antenna module using benzocyclobutene and silicon micromachining

2004 2004

Other formats: Order a copy

Abstract (summary)

A highly integrated millimeter wave active antenna array is implemented using a novel multichip packaging technique. The goal of the new packaging scheme is to allow the implementation of very compact hybrid multi-chip modules using a low cost micro-machined silicon motherboard and benzocyclobutene (BCB) films. The excellent planarity of BCB allows interlayer connections to be formed using bumps fabricated prior to BCB application. This approach eliminates the need for laser drilling, plasma etching, and plated holes.

The effects of the packaging on the electrical performance of active devices and passive structures are studied. Several representative GaAs pHEMTs are packaged using this technique. Measurements show minimal performance degradation from 1 GHz to 48 GHz. Passive MMIC structures are also studied and small but significant degradation is reported. The interconnection discontinuities formed by the package are studied in detail and lumped circuit models are generated. The performance of these discontinuities as a function of variations in the fabrication process is analyzed. Relatively small changes are noted. This is a major advantage when compared to other interconnection techniques such as bond wires.

The design and measurements of an LNA and mixer MMIC for LMDS applications are presented. The LNA consists of four cascaded stages and the mixer designed is a second harmonic anti-parallel diode configuration. The MMIC is packaged and its performance is characterized.

An antenna architecture compatible with the developed package is proposed. The implementation of active antenna arrays with the presented package scheme is difficult due to the size of the active circuitry. This creates array radiation patterns with large side lobes. Several configurations that reduce this problem are investigated. One array has been fabricated and its measured performance analyzed.

Finally, a highly integrated active antenna array module is presented. The module consists of a 1 x 4 antenna sub-array and a MMIC with an integrated LNA and mixer. This module is extremely compact with a size of only 1.4 x 1.1cm. Its performance is characterized and a loss budget presented.

Indexing (details)

Electrical engineering
0544: Electrical engineering
Identifier / keyword
Applied sciences; Antenna; Benzocyclobutene; Micromachining; Millimeter-wave; Silicon
Design of a millimeter wave active antenna module using benzocyclobutene and silicon micromachining
Carrillo-Ramirez, Rodrigo
Number of pages
Publication year
Degree date
School code
DAI-B 65/01, Dissertation Abstracts International
Place of publication
Ann Arbor
Country of publication
United States
Jackson, Robert W.
University of Massachusetts Amherst
University location
United States -- Massachusetts
Source type
Dissertations & Theses
Document type
Dissertation/thesis number
ProQuest document ID
Database copyright ProQuest LLC; ProQuest does not claim copyright in the individual underlying works.
Document URL
Access the complete full text

You can get the full text of this document if it is part of your institution's ProQuest subscription.

Try one of the following:

  • Connect to ProQuest through your library network and search for the document from there.
  • Request the document from your library.
  • Go to the ProQuest login page and enter a ProQuest or My Research username / password.